XPAK Multi-source Agreement (MSA) was published in 2002, which have the member of Blaze, E2O Communications, Opteon, Fujitsu, Picolight, Infineon Technologies, Intel, Tyco Electronics, and Molex. In the XPAK MSA, it defines mechanical, thermal, and electromagnetic interference (EMI) mitigation features of the form factor, as well as reference 10-GbE optical and XENPAK MSA electrical specifications. Offering higher port density, power efficiency, and ease of integration to networking equipment, the XPAK module enables network equipment manufacturers to implement 10-GbE links up to 10- and eventually, 40-kilometers, claim group representatives. This increased distance enables 10-Gigabit Ethernet to move from aggregated uplink applications to high-volume, server-to-switch, and storage-to-switch links.